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=> "Future of AI Hardware Enabled by Advanced Packaging", Sam Naffziger, SVP and Corporate Fellow, AMD, HIR Special Session, ECTC 2024, May 28 https://t.co/sR7TJIyqWh MI300, ISCA 2024 https://t.co/uGmw3j5Bwt ISCA 2023 Si-Photonic, AMD (Xilinx), ISSCC 2023 https://t.co/V81fmV3Ui3 https://t.co/WOtwiCUGjk

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