条件を指定して検索しています。すべての条件を解除する
Enter multiple molecules separated by whitespace or by comma. ... Search specific patents by importing a CSV or list of patent publication or application numbers.
SF6 is usually used as an etching gas for film etching and silicon etching. SF6 dissociates in plasma to form SF4 or SF2 and atomic fluorine that reacts with ...
Magnetically Enhanced Reactive Ion Etching (MERIE) An oxide etch performed in a plasma reactor. The etching gas has approximately equal amounts of ...
Foranext® fluorogases play an important role in a variety of manufacturing steps during the fabrication of semiconductor devices.
schematic view of the plasma etching apparatus employed is shown in Fig. 2. Etching gas is introduced into the reactor through a quartz shower plate, which ...
New Qulee RGM2-201 F gas analyzer for CVD/etching/ALD devices! Compact design for limited space in production plant and time required for ...
YouTube-株式会社アルバック ULVAC, Inc.
2021/9/29 -These processes include wafer thinning, surface texture control, gate recess, mesa etch, UBM etch and selective etching ... Gas seal tooling to ...
次世代の環境配慮型エッチングガスです。既存のNF3やCF系のガスと比較し環境負荷を抑えることが可能です。
It is also a versatile system that enables etching, ashing, and ion cleaning by switching gas types and plasma modes. Features. RIE mode and DP mode can be ...
It is preferable that the first etching gas contains the gas for which an etching gas is diluted by the Xe gas or the gas mixture of the Xe gas and an Ar gas.